Availability of conventional metallic particle based pastes such as Silver (Ag) and Copper (Cu) based pastes in sinterable electronics paste market have come out one of the excellent alternatives for Sn-based traditional die-attach materials suitable for Wide Band-gap Semi-conductor (WBG) devices. Submicron/nano Cu particle based sintering pastes have certain advantages such as lower cost and better electrochemical migration reliability than the corresponding Ag particle pastes although their corresponding sintered joints possess similar mechanical, electrical and thermal properties. But, the major drawback of Cu particle based pastes is the intrinsic oxidation tendency of Cu particles in ambient condition; hence hindering the effective sintering of Cu particles. Performing die-attachment with particle based Cu sintering paste at high sintering temperature such as 400 °C with high pressure under reducing forming gas either inert argon, nitrogen or formic acid environment might lead to higher shear join strength; unacceptable for practical application due to these harsh and complicated sintering conditions. This proposed research strategy would give a solution to this above mentioned challenges which involves a metal-organic or organo-metallic precursor based printable Cu paste/ink which should eliminate most of the obstacles encountered during the electronics assembly process using conventional market available Cu based printable electronics paste.